Material: High-purity fused quartz (SiO₂)
Applications: Semiconductors, precision optics, UV lithography, spectroscopy, laser systems, high-temperature processing

1. Optical Properties

Parameter	Typical Value	Notes / Applications
Wavelength Range	190–2500 nm	Deep UV to near-infrared
Transmittance @ 200 nm	>80%	UV optics, spectroscopy
Transmittance 260–2000 nm	>90%	Visible to near-IR applications
Surface Quality (S/D)	40/20 – 20/10	Optical-grade wafers for coating or laser systems
Refractive Index	1.458–1.460 (at 589 nm)	Stable across temperature and wavelength
Bubble / Inclusion Level	Minimal / None visible	Critical for high-precision optics

Notes: Quartz wafers maintain excellent transmission in the deep UV (<260 nm), outperforming ordinary glass for UV lithography and laser applications.

2. Chemical Properties

Parameter	Typical Value	Notes / Applications
Material Composition	>99.99% SiO₂	High-purity fused quartz
Acid Resistance	Excellent (except HF)	Semiconductor wet etching, chemical labware
Alkali Resistance	Excellent	Maintains optical clarity in basic solutions
Oxidation Resistance	High	Suitable for high-temperature and oxidative environments

Notes: Quartz wafers act as a chemically stable barrier, preserving optical and mechanical integrity under harsh conditions.

3. Purity and Impurity Control

Parameter	Typical Value	Notes / Applications
Metal Impurities	<1 ppm (Na, K, Fe)	Ultra-pure quartz minimizes ionic contamination in IC fabrication
High-Temperature Ion Stability	No mobile ion release	Critical for semiconductor and optical fiber manufacturing
Manufacturing Process	Chloride refining + high-temperature purification	Ensures ultra-low contamination and stable optical properties

 

4. Thermal Properties

Parameter	Typical Value	Notes / Applications
Coefficient of Thermal Expansion (CTE)	~5.5×10⁻⁷/K	Excellent thermal shock resistance
Softening Point	~1665 °C	High-temperature furnace applications
Maximum Continuous Operating Temperature	1100 °C	Suitable for high-temperature optics, laser windows
Thermal Conductivity	~1.38 W/m·K	Reduces temperature gradient stress

Notes: Quartz wafers remain dimensionally stable and mechanically robust under high thermal loads, unlike ordinary glass.

5. Typical Surface & Geometrical Specifications

Parameter	Standard Values
Diameter Tolerance	±0.01 mm (or better)
Thickness Tolerance	±0.01 mm (or better)
Total Thickness Variation (TTV)	≤5 µm for high-end optics
Warp / Bow	≤25 µm typical
Edge Chamfer	Standard 0.2–0.5 mm, reduces breakage risk
Surface Roughness (Ra)	≤0.5 nm

 

6. Summary of Key Advantages

Ultra-wide spectral transmittance: Deep UV to near-IR
Exceptional chemical stability: Resistant to acids (except HF) and oxidation
High purity: Minimizes ionic contamination for microelectronics
Thermal stability: Low CTE, high softening point, excellent shock resistance
Precision processing: Tight geometrical and surface tolerances for advanced optics

7. Customization and Supply

Diameter, thickness, and surface finish can be tailored to customer specifications
High-volume supply with batch consistency and full testing reports
Supports optical windows, UV lithography, laser optics, semiconductor substrates, and high-temperature applications
Conclusion: Selecting high-quality quartz wafers ensures optical clarity, chemical robustness, and thermal stability, providing reliable performance in advanced manufacturing and research applications.