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AlN Substrate

Specific Information
As a typical representative of the fourth-generation semiconductor materials, aluminum nitride(AlN) has superior physical and chemical properties such as ultra-wide bandgap, high thermal conductivity, high breakdown field strength, corrosion resistance, and radiation resistance.It is especially suitable for the manufacture of opto-electronics devices,dielectric layers in optical storage media,electronic substrates, chip carriers.
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  • specification
  • Properties
  • ItemAlN Substrate(1~2inch)
    Diameter25.4±0.3mm50.8±0.5mm
    Thickness400±50μm400±50μm
    Crystal Type2H
    Surface Orientation(0001) ± 0.5°
    Primary Flat Orientation(10-10) ± 5.0˚
    Secondary Flat OrientationAl face up: 90.0˚ CW from Primary ± 5.0˚
    Front Surface FinishAl face:≤ 0.5 nm
    Back Surface FinishN face:≤ 1.2μm
    Laser MarkBack side:N-Face
    TTV≤25μm≤30μm
    BOW≤30μm≤35μm
    WARP≤40μm≤45μm
    Edge Exclusion≤5 mm


    Customization specifications:

    * Various sizes and shapes such as 10*10mm.

    * Special orientations like non-polar M-plane AlN crystal substrate.

    * Various surface roughness such as slicing,lapping.


  • Aluminum nitride(AlN) is a solid nitride of aluminium,white or off-white.It exists primarily in the hexagonal wurtzite crystal structure, but also has a metastable cubic zincblende phase, which is synthesized primarily in the form of thin films.AlN has the electrically insulating nature and high thermal conductivity.


    Crystal StructureHexagonal 
    Lattice Constant(nm)a=0.3112Å  c=0.4982Å
    Density(g/cm3)3.23
    Melting point(℃)2750
    Mohs Hardness(mohs)9
    Dielectric Constant8.15
    Band Gap(eV)6.2
    Breakdown Electrical Field (MV/cm)11.7
    Thermal Conductivity(W/cm.K)4.8
    Thermal Expansion 4. 84*10-6/k


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